Full 600 mm Panel Coverage in a Single Measuring Operation

With the launch of the NEXIV VMF-K6561, Nikon Corporation expands its proven NEXIV 3D confocal series with a pioneering high-end video measuring system. The key innovation: a massively enlarged stage that enables seamless and highly efficient measurement of Panel-Level Packages (PLP) and large-format substrates up to 600 × 600 mm without time-consuming re-clamping.

In modern semiconductor manufacturing, microtechnology, and electronic component production, demands for throughput and precision are continuously rising. In the past, handling large substrates often posed major logistical challenges for quality assurance. This is precisely where the new Nikon NEXIV VMF-K6561 comes into play.

Maximum Measuring Volume for Ultimate Efficiency

Based on the advanced technology of the NEXIV VMF-K series, the new model is equipped with a generous 650 × 610 mm stage. This allows a complete large-format panel (600 × 600 mm) to be fully and automatically analyzed in a single setup.

Production bottlenecks—previously caused by sequential repositioning or stitching different measurement areas—are now a thing of the past. Furthermore, Nikon's proven high-speed measurement technology ensures extremely short cycle times when capturing complex 3D geometries.

Stability and Precision Down to the Micrometer

To guarantee absolute accuracy over such large travel distances in the long term, Nikon has fundamentally optimized the design of the stage. A significantly increased stage glass thickness ensures maximum rigidity and zero distortion. Even under heavy loads, the system remains perfectly stable—a mandatory prerequisite for reproducible, micrometer-level measurement results demanded by the Swiss precision industry.

Key Highlights of the NEXIV VMF-K6561 at a Glance:

• Full 600 mm Panel Coverage: Measure large formats in a single setup with zero dead time.
• 3D Optical Confocal Sensor Technology: First-class height resolution and high-contrast capturing of the finest surface structures, circuit traces, and micro-bumps.
• Robust Mechanics: Extra-thick stage glass and optimized axis guides for uncompromising stability.
• High Throughput: Intelligent software algorithms drastically shorten inspection cycles during serial measurements.